Thin Type Water Cooling Plate using P-B bonding method / Takagi Mfg. Co., Ltd. H&C Company


In recent years, needs for thin type water cooling plate for fuel cell, semi conductor laser and power devices, etc. are increasing. P-B bonding method, using Plating and Brazing has been conducted in several fields. We use this method and can supply with much reasonable and reliable products compared with conventional diffusion bonding.

1. P-B Bonding

(Ag) plated copper plate with water channel formed by etching is sandwiched by 2 Cu plates and heated in hydrogen furnace or vacuum atmosphere furnace.
(Ag) plating of water channel plate brazes the sandwiched plates with high reliability.
P-B Bonding

2. Material

Oxygen free copper is standard. Stainless steel, etc. can be used.

3. Size

Minimum 10 [mm] square, thickness 0.9 [mm]. Maximum 300 [mm] square, thickness 3 [mm]. Round shape is also available.

4. Variation

Same water channel plates are laminated for large area, or different water channel plates are laminated for strengthen cooling capacity. (Laminated plate)
Manifold can be installed as water outlet.

Contact:
Takagi Mfg. Co., Ltd., Overseas Operations
Fax: +81-29-272-4403
E-mail: takagiss@mva.biglobe.ne.jp